Taiwan minister supported development of chip technologies in Brno

Taiwan's Foreign Minister Lin Chia-lung visited Brno in September 2025, where he toured the Advanced Chip Design and Research Center (ACDRC) and the laboratories of the Faculty of Electrical Engineering and Communication Technologies at Brno University of Technology (FEEC BUT).

Taiwan's Foreign Minister Lin Chia-lung and BUT Rector Ladislav Janíček during the visit to FEEC BUT. | Author: Jakub Rozboud

During the Taiwanese Foreign Minister's visit, they were welcomed by Rector Ladislav Janíček, Vice-Dean Stanislav Klusáček, and Lukáš Fujcik, who leads the Integrated Circuits and Special Electronic Systems Group at the Institute of Microelectronics, FEEC BUT.

The ACDRC itself was opened in October 2024 in the premises of the Cyber Security Hub in Brno. Since then, it has become one of the most important points of Czech-Taiwanese cooperation in the field of semiconductor technologies. On the Czech side, three leading universities are involved in the project – BUT, CTU (Czech Technical University), and Masaryk University – which, together with Taiwanese academic institutions and companies, are developing joint research, innovation, and education in high value-added technological fields.

Taiwan's Foreign Minister Lin Chia-lung visiting FEEC BUT - Alexandr Otáhal presenting his research group's work. | Author: Jakub Rozboud

Taiwan-Czech Resilience Program

The center is part of a broader initiative called the Taiwan-Czech Resilience Program, which was created to strengthen the resilience of both countries in key areas of future development. The program connects academic institutions, research centers, and industrial partners to jointly seek solutions in areas of strategic importance – from semiconductors through energy to cybersecurity. The program also includes support for education and human capital development, meaning specialists who will be able to advance both Czech and Taiwanese technological sectors.

Main Pillars of Cooperation

Research and development in semiconductors – focused on integrated circuit design, new materials, and artificial intelligence applications.
Education and student mobility – exchange stays, summer schools, courses led by Taiwanese experts, and student internships abroad.
Industry cooperation and innovation – involvement of companies, utilization of research results in automotive and energy industries, biomedicine, and telecommunications.
Strategic technologies and security – development of cybersecurity, quantum technologies, 3D printing, or nanotechnologies with long-term impact.

More about the center's opening on the FEEC BUT website.